Plating bath and method

ABSTRACT

Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.

The present invention relates generally to the field of electrolytic metal plating. In particular, the present invention relates to the field of electrolytic copper plating.

Methods for electroplating articles with metal coatings generally involve passing a current between two electrodes in a plating solution where one of the electrodes is the article to be plated. A typical acid copper plating solution comprises dissolved copper (usually copper sulfate), an acid electrolyte such as sulfuric acid in an amount sufficient to impart conductivity to the bath, and proprietary additives to improve the uniformity of the plating and the quality of the metal deposit. Such additives include accelerators, levelers, and suppressors, among others.

Electrolytic copper plating solutions are used in a variety of industrial applications, such as decorative and anticorrosion coatings, as well as in the electronics industry, particularly for the fabrication of printed circuit boards and semiconductors. For circuit board fabrication, copper is electroplated over selected portions of the surface of a printed circuit board, into blind vias and onto the walls of through-holes passing between the surfaces of the circuit board base material. The walls of a through-hole are first made conductive, such as by electroless metal deposition, before copper is electroplated onto the walls of the through-hole. Plated through-holes provide a conductive pathway from one board surface to the other. For semiconductor fabrication, copper is electroplated over a surface of a wafer containing a variety of features such as vias, trenches or a combination thereof. The vias and trenches are metallized to provide conductivity between various layers of the semiconductor device.

It is well known in certain areas of plating, such as in electroplating of printed circuit boards (“PCBs”), that the use of accelerators and/or levelers in the electroplating bath can be crucial in achieving a uniform metal deposit on a substrate surface. Plating a substrate having irregular topography can pose particular difficulties. During electroplating a voltage drop variation typically will exist along an irregular surface which can result in an uneven metal deposit. Plating irregularities are exacerbated where the voltage drop variation is relatively extreme, that is, where the surface irregularity is substantial. As a result, a thicker metal deposit, termed overplating, is observed over such surface irregularities. Consequently, a metal layer of substantially uniform thickness is frequently a challenging step in the manufacture of electronic devices. Leveling agents are often used in copper plating baths to provide substantially uniform, or level, copper layers in electronic devices.

The trend of portability combined with increased functionality of electronic devices has driven the miniaturization of PCBs. Conventional multilayer PCBs with through hole interconnect vias are not always a practical solution. Alternative approaches for high density interconnects have been developed, such as sequential build up technologies, which utilize blind vias. One of the objectives in processes that use blind vias is the maximizing of via filling while minimizing thickness variation in the copper deposit across the substrate surface. This is particularly challenging when the PCB contains both through holes and blind vias.

Generally, leveling agents used in copper plating baths provide better leveling of the deposit across the substrate surface but tend to worsen the throwing power of the electroplating bath. Throwing power is defined as the ratio of the hole center copper deposit thickness to its thickness at the surface. Newer PCBs are being manufactured that contain both through holes and blind vias. Current bath additives, in particular current leveling agents, do not provide level copper deposits on the substrate surface and fill through-holes and/or fill blind vias effectively.

For example, U.S. Pat. No. 7,374,652 (Hayashi et al.) discloses a method of producing level copper deposits by electroplating copper from a copper plating bath containing a leveling agent that is a reaction product of a certain unsubstituted heterocyclic amine with a polyepoxide compound containing an alkyleneoxy linkage. Even with such leveling agents, level and nodule-free copper deposits on substrate surfaces and filled through-holes or blind vias are not always produced. There remains a need in the art for leveling agents for use in copper electroplating baths used in the manufacture of PCBs that provide level copper deposits while not significantly affecting the throwing power of the bath, that is, the bath effectively fills blind vias and through-holes.

The present invention provides a reaction product of one or more nitrogen-containing compounds with one or more epoxide-containing compounds of formula (I) or (II)

wherein Y¹ and Y² are independently chosen from H and (C₁-C₄)alkyl; Z is Ar, R¹²OArOR¹², (R¹³O)_(a)Ar(OR¹³)_(a), Cy, R¹²CyR¹², or (R¹³O)_(a)Cy(OR¹³)_(a); r=1-4; Ar=(C₆-C₁₈)aryl; Cy=(C₅-C₁₂)cycloalkyl; each R¹² represents (C₁-C₈)alkyl; each R¹³ represents a (C₂-C₆)alkyleneoxy; each a=1-10; and A represents (C₅-C₁₂)cycloalkyl.

The present invention also provides a copper electroplating bath including: a source of copper ions, an electrolyte, and a leveling agent, wherein the leveling agent is a reaction product of one or more nitrogen-containing compounds with one or more epoxide-containing compounds of formula (I) or (II)

wherein Y¹ and Y² are independently chosen from H and (C₁-C₄)alkyl; Z is Ar, R¹²OArOR¹², (R¹³O)_(a)Ar(OR¹³)_(a), Cy, R¹²CyR¹², or (R¹³O)_(a)Cy(OR¹³)_(a); r=1-4; Ar=(C₆-C₁₈)aryl; Cy=(C₅-C₁₂)cycloalkyl; each R¹² represents (C₁-C₈)alkyl; each R¹³ represents a (C₂-C₆)alkyleneoxy; each a=1-10; and A represents (C₅-C₁₂)cycloalkyl.

The present invention further provides a method of depositing copper on a substrate including: contacting a substrate to be plated with copper into a copper electroplating bath including: a source of copper ions, an electrolyte, and a leveling agent, wherein the leveling agent is a reaction product of one or more nitrogen-containing compounds with one or more epoxide-containing compounds of formula (I) or (II)

wherein Y¹ and Y² are independently chosen from H and (C₁-C₄)alkyl; Z is Ar, R¹²OArOR¹², (R¹³O)_(a)Ar(OR¹³)_(a), Cy, R¹²CyR¹², or (R¹³O)_(a)Cy(OR¹³)_(a); r=1-4; Ar=(C₆-C₁₈)aryl; Cy=(C₅-C₁₂)cycloalkyl; each R¹² represents (C₁-C₈)alkyl; each R¹³ represents a (C₂-C₆)alkyleneoxy; each a=1-10; and A represents (C₅-C₁₂)cycloalkyl; and applying a current density for a period of time sufficient to deposit a copper layer on the substrate.

It has been surprisingly found that the present invention provides copper layers having a substantially level surface across a PCB substrate, even on substrates having very small features and on substrates having a variety of feature sizes. The copper layers deposited according to the present method have significantly reduced defects, such as nodules, as compared to copper deposits from electroplating baths using conventional leveling agents. Further, the present invention effectively deposits copper in through-holes and blind via holes, that is, the present copper plating baths have good throwing power.

As used throughout this specification, the following abbreviations shall have the following meanings, unless the context clearly indicates otherwise: A=amperes; A/dm²=amperes per square decimeter; ° C.=degrees Centigrade; g=gram; mg=milligram; L=liter, L/m=liters per minute; ppm=parts per million; μm=micron=micrometer; mm=millimeters; cm=centimeters; DI=deionized; and mL=milliliter. All amounts are percent by weight and all ratios are molar ratios, unless otherwise noted. All numerical ranges are inclusive and combinable in any order, except where it is clear that such numerical ranges are constrained to add up to 100%.

As used throughout the specification, “feature” refers to the geometries on a substrate. “Apertures” refer to recessed features including through-holes and blind vias. As used throughout this specification, the term “plating” refers to metal electroplating. “Deposition” and “plating” are used interchangeably throughout this specification. “Halide” refers to fluoride, chloride, bromide and iodide. Likewise, “halo” refers to fluoro, chloro, bromo and iodo. The term “alkyl” includes linear, branched and cyclic alkyl. “Accelerator” refers to an organic additive that increases the plating rate of the electroplating bath. A “suppressor” refers to an organic additive that suppresses the plating rate of a metal during electroplating. “Leveler” refers to an organic compound that is capable of providing a substantially level (or planar) metal layer. The terms “leveler” and “leveling agent” are used interchangeably throughout this specification. The terms “printed circuit boards” and “printed wiring boards” are used interchangeably throughout this specification. The articles “a” and “an” refer to the singular and the plural.

The plating bath and method of the present invention are useful in providing a substantially level plated copper layer on a substrate, such as a printed circuit board. Also, the present invention is useful in filling apertures in a substrate with copper. Such filled apertures are substantially free of voids. Also, the copper deposits from the present invention are substantially free of nodules, that is, they contain ≦15 nodules/95 cm² surface area.

Any substrate upon which copper can be electroplated is useful in the present invention. Such substrates include, but are not limited to, electronic devices such as printed wiring boards, integrated circuits, semiconductor packages, lead frames and interconnects. It is preferred that the substrate is a PCB or an integrated circuit. In one embodiment, the integrated circuit substrate is a wafer used in a dual damascene manufacturing process. Such substrates typically contain a number of features, particularly apertures, having a variety of sizes. Through-holes in a PCB may have a variety of diameters, such as from 50 μm to 150 μm in diameter. Such through-holes may vary in depth, such as from 35 μm to 100 μm. PCBs may contain blind vias having a wide variety of sizes, such as up to 200 μm, or greater. The present invention is particularly suitable for filling apertures, of varying aspect ratios, such as low aspect ratio vias and high aspect ratio apertures. By “low aspect ratio” is meant an aspect ratio of from 0.1:1 to 4:1. The term “high aspect ratio” refers to aspect ratios of greater than 4:1, such as 10:1 or 20:1.

The copper plating baths of the present invention contain a source of copper ions, an electrolyte, and a leveling agent, wherein the leveling agent is a reaction product of one or more nitrogen-containing compounds with one or more epoxide-containing compounds of formula (I) or (II)

wherein Y¹ and Y² are independently chosen from H and (C₁-C₄)alkyl; Z is Ar, R¹²OArOR¹², (R¹³O)_(a)Ar(OR¹³)_(a), Cy, R¹²CyR¹², or (R¹³O)_(a)Cy(OR¹³)_(a); r=1-4; Ar=(C₆-C₁₈)aryl; Cy=(C₅-C₁₂)cycloalkyl; each R¹² represents (C₁-C₈)alkyl; each R¹³ represents a (C₂-C₆)alkyleneoxy; each a=1-10; and A represents (C₅-C₁₂)cycloalkyl. The copper plating baths also typically contain a source of halide ions, an accelerator and a suppressor.

Any copper ion source that is at least partially soluble in the electroplating bath is suitable. Preferably, the copper ion source is soluble in the plating bath. Suitable copper ion sources are copper salts and include without limitation: copper sulfate; copper halides such as copper chloride; copper acetate; copper nitrate; copper fluoroborate; copper alkylsulfonates; copper arylsulfonates; copper sulfamate; and copper gluconate. Exemplary copper alkylsulfonates include copper (C₁-C₆)alkylsulfonate and more preferably copper (C₁-C₃)alkylsulfonate. Preferred copper alkylsulfonates are copper methanesulfonate, copper ethanesulfonate and copper propanesulfonate. Exemplary copper arylsulfonates include, without limitation, copper phenyl sulfonate, copper phenol sulfonate and copper p-toluene sulfonate. Copper sulfate and copper methanesulfonic acid are preferred. Mixtures of copper ion sources may be used. It will be appreciated by those skilled in the art that one or more salts of metal ions other than copper ions may be advantageously added to the present electroplating baths. The addition of such other metal ion sources are useful in the deposition of copper alloys. Such copper salts are generally commercially available and may be used without further purification.

The copper salts may be used in the present plating baths in any amount that provides sufficient copper ion concentration for electroplating copper on a substrate. Preferably, the copper salt is present in an amount sufficient to provide an amount of copper metal of 10 to 180 g/L of plating solution. Alloys, such as copper-tin, for example, copper having up to 2% by weight tin, may be advantageously plated according to the present invention. Other suitable copper alloys include, but are not limited to copper-silver, tin-copper-silver, and tin-copper-bismuth. The amount of each of the metal salts in such mixtures depends upon the particular alloy to be plated and is well known to those skilled in the art.

The electrolyte useful in the present invention may be alkaline or acidic. Suitable acidic electrolytes include, but are not limited to, sulfuric acid, acetic acid, fluoroboric acid, alkanesulfonic acids such as methanesulfonic acid, ethanesulfonic acid, propanesulfonic acid and trifluoromethane sulfonic acid, arylsulfonic acids such as phenyl sulfonic acid, phenol sulfonic acid and toluene sulfonic acid, sulfamic acid, hydrochloric acid, and phosphoric acid. Mixtures of acids may be advantageously used in the present metal plating baths. Preferred acids include sulfuric acid, methanesulfonic acid, ethanesulfonic acid, propanesulfonic acid, and mixtures thereof. The acids are preferably present in an amount in the range of from 1 to 300 g/L, more preferably from 5 to 250 g/L, and still more preferably from 10 to 225 g/L. Electrolytes are generally commercially available from a variety of sources and may be used without further purification.

Such electrolytes may optionally contain a source of halide ions. Chloride ions are the preferred halide ions. Exemplary chloride ion sources include copper chloride and hydrochloric acid. A wide range of halide ion concentrations may be used in the present invention. Typically, the halide ion concentration is in the range of from 0 to 100 ppm based on the plating bath, and preferably from 10 to 100 ppm. A preferably amount of halide ion is from 20 to 75 ppm. Such halide ion sources are generally commercially available and may be used without further purification.

The present plating baths typically contain an accelerator. Any accelerators (also referred to as brightening agents) are suitable for use in the present invention. Such accelerators are well-known to those skilled in the art. Typical accelerators contain one or more sulfur atoms and have a molecular weight of 1000 or less. Accelerator compounds that have sulfide and/or sulfonic acid groups are generally preferred, particularly compounds that include a group of the formula R′—S—R—SO₃X, where R is optionally substituted alkyl, optionally substituted heteroalkyl, optionally substituted aryl, or optionally substituted heterocyclic; X is a counter ion such as sodium or potassium; and R′ is hydrogen or a chemical bond. Typically, the alkyl groups are (C₁-C₁₆)alkyl and preferably (C₃-C₁₂)alkyl. Heteroalkyl groups typically have one or more heteroatoms, such as nitrogen, sulfur or oxygen, in the alkyl chain. Suitable aryl groups include, but are not limited to, phenyl, benzyl, biphenyl and naphthyl. Suitable heterocyclic groups typically contain from 1 to 3 heteroatoms, such as nitrogen, sulfur or oxygen, and 1 to 3 separate or fused ring systems. Such heterocyclic groups may be aromatic or non-aromatic. Specific accelerators preferred for use in the present invention include, but are not limited to, N,N-dimethyl-dithiocarbamic acid-(3-sulfopropyl)ester; 3-mercapto-propylsulfonic acid-(3-sulfopropyl)ester; 3-mercapto-propylsulfonic acid sodium salt; carbonic acid-dithio-o-ethylester-s-ester with 3-mercapto-1-propane sulfonic acid potassium salt; bis-sulfopropyl disulfide; 3-(benzothiazolyl-s-thio)propyl sulfonic acid sodium salt; pyridinium propyl sulfobetaine; 1-sodium-3-mercaptopropane-1-sulfonate; N,N-dimethyl-dithiocarbamic acid-(3-sulfoethyl)ester; 3-mercapto-ethyl propylsulfonic acid-(3-sulfoethyl)ester; 3-mercapto-ethylsulfonic acid sodium salt; carbonic acid-dithio-o-ethylester-s-ester with 3-mercapto-1-ethane sulfonic acid potassium salt; bis-sulfoethyl disulfide; 3-(benzothiazolyl-s-thio)ethyl sulfonic acid sodium salt; pyridinium ethyl sulfobetaine; and 1-sodium-3-mercaptoethane-1-sulfonate.

Such accelerators may be used in a variety of amounts. In general, accelerators are used in an amount of at least 0.01 mg/L, based on the bath, preferably at least 0.5 mg/L, and more preferably at least 1 mg/L. For example, the accelerators are present in an amount of from 0.1 mg/L to 200 mg/L. The particular amount of accelerator will depend upon the specific application, such as high aspect ratio, through-hole filling, and via filling applications. Preferable amounts of accelerator useful in the present invention are at least 0.5 mg/L, and more preferably at least 1 mg/L. A preferable range of such accelerator concentrations is from 0.1 to 10 mg/L.

Any compound capable of suppressing the copper plating rate may be used as a suppressor in the present electroplating baths. Suitable suppressors include, but are not limited to, polymeric materials, particularly those having heteroatom substitution, and more particularly oxygen substitution. Exemplary suppressors are high molecular weight polyethers, such as those of the formula R—O—(CXYCX′Y′O)_(n)R′ where R and R′ are independently chosen from H, (C₂-C₂₀)alkyl group and (C₆-C₁₀)aryl group; each of X, Y, X′ and Y′ is independently selected from hydrogen, alkyl such as methyl, ethyl or propyl, aryl such as phenyl, or aralkyl such as benzyl; and n is an integer from 3 to 10,000. Preferably, one or more of X, Y, X′ and Y′ is hydrogen. Preferred suppressors include commercially available polypropylene glycol copolymers and polyethylene glycol copolymers, including ethylene oxide-propylene oxide (“EO/PO”) copolymers and butyl alcohol-ethylene oxide-propylene oxide copolymers. Suitable butyl alcohol-ethylene oxide-propylene oxide copolymers are those having a weight average molecular weight of 500 to 10,000 and preferably 1000 to 10,000. When such suppressors are used, they are typically present in an amount in the range of from 1 to 10,000 ppm based on the weight of the bath, and preferably from 5 to 10,000 ppm.

The reaction products of the present invention contain at least one nitrogen-containing compound reacted with the epoxide-containing compound of formula (I) or (II). Such nitrogen-containing compound may be acyclic or cyclic. Preferably, the nitrogen-containing compound is cyclic. More preferably the nitrogen is contained within such cyclic group, that is, the nitrogen-containing compound is more preferably a nitrogen-containing heterocyclic compound. Suitable nitrogen-containing compounds include, but are not limited to, amines, amides, ureas, guanides, uracils, thiouracils, pyrrolidines, imidazoles, triazoles, tetrazoles, benzimidazoles, benzotriazoles, piperidines, morpholines, piperazines, pyridines, oxazoles, benzoxazoles, pyrimidines, quinolines, and isoquinolines. Such nitrogen-containing compounds may contain more than one nitrogen atom.

Suitable amines for use in the present invention include primary, secondary and tertiary amines. Preferably, the amine compound is a secondary or tertiary amine. Such amines may be monamines, diamines, triamines, and the like. Monoamines and diamines are preferred. Suitable amines may be acyclic or cyclic amines. Exemplary acyclic amines are those of the formula R¹R²R³N, where R¹ and R² are independently chosen from H, (C₁-C₆)alkyl, ar(C₁-C₆)alkyl, (C₁-C₆)alkylNR⁴R⁵, and aryl; R³ is chosen from (C₁-C₆)alkyl, ar(C₁-C₆)alkyl and aryl; and R⁴ and R⁵ are independently chosen from H and (C₁-C₆)alkyl. The aryl group may be substituted with one or more substituents, such as halo, (C₁-C₄)alkyl, (C₁-C₄)alkoxy and hydroxy. Suitable acyclic amine compounds useful in the preparing the present leveling agents include, without limitation, di(C₁-C₆)alkylamines, tri(C₁-C₆)alkylamines, alkylenediamines, alkylated alkylenediamines, aryl(C₁-C₆)alkylamines, aryldi(C₁-C₆)alkylamines and diarylamines. Such acyclic amines include diethylamine, dipropylamine, dibutylamine, tripropylamine, ethylenediamine, N,N,N′,N′-tetramethylethylenediamine, propylenediamine, cyclopentylamine, cyclopentylmethylamine, cyclohexylamine, cyclohexylmethylamine, cyclohexyl-bis(methylamine), aniline, N-methylaniline, N,N-dimethylaniline, diphenylamine, benzylamine, and dibenzylamine.

Any suitable cyclic nitrogen-containing compound may be used to prepare the present reaction products. Exemplary classes of cyclic amine compounds include, but are not limited to, pyrrolidines, imidazoles, triazoles, tetrazoles, benzimidazoles, benzotriazoles, piperidines, morpholines, piperazines, pyridines, oxazoles, benzoxazoles, pyrimidines, quinolines, and isoquinolines. It will be appreciated by those skilled in the art that each class of cyclic amine compounds includes the unsubstituted cyclic amine as well as substituted cyclic amines. By way of example, the class of imidazoles includes imidazole itself as well as various substituted imidazoles. By substituted cyclic amines, it is meant that one or more hydrogen atoms are replaced with one or more substituent groups, such as halo, cyano, (C₁-C₄)alkyl, hydroxy(C₁-C₄)alkyl, aryl, and ar(C₁-C₄)alkyl. The aryl group may be substituted or unsubstituted. Exemplary substituent groups include, but are not limited to, methyl, ethyl, propyl, butyl, phenyl, tolyl, xylyl, benzyl, and phenethyl. Preferred classes of cyclic amine compounds include imidazoles and pyridines. Preferred cyclic amine compounds include: imidazole; 4-methylimidazole; 4-phenylimidazole; 5-phenylimidazole; 4,5-dimethylimidazole; 2-phenylimidazole; 2-methylimidazole; 2-butyl-4-hydroxymethylimidazole; 4,5-dicyanoimidazole; 2-ethylimidazole; 4-ethylimidazole; 2-isopropylimidazole; 4-hydroxymethylimidazole; 4-hydroxyethylimidazole; 4,5-dichloroimidazole; 2-(naphthylmethyl)imidazole; 2-ethyl-4-methylimidazole; benzimidazole; 2-hydroxybenzimidazole; 2-methylbenzimidazole; pyridine; 2,6-pyridinedimethanol; 3-pyridinepropanol; 2-methylpyridine; 4-methylpyridine; 2,4-dimethylpyridine; pyrrolidine, N-methylpyrrolidinde, triazole; benzotriazole; and tetrazole.

The amine compounds useful in the present invention are generally commercially available from a variety of sources, such as Sigma-Aldrich (St. Louis, Mo.) or may be prepared from literature methods.

The epoxide-containing compounds used in the present reaction products are those of formula (I) or (II)

wherein Y¹ and Y² are independently chosen from H and (C₁-C₄)alkyl; Z is Ar, R¹²OArOR¹², (R¹³O)_(a)Ar(OR¹³)_(a), Cy, R¹²CyR¹², or (R¹³O)_(a)Cy(OR¹³)_(a); r=1-4; Ar=(C₆-C₁₈)aryl; Cy=(C₅-C₁₂)cycloalkyl; each R¹² represents (C₁-C₈)alkyl; each R¹³ represents a (C₂-C₆)alkyleneoxy; each a=1-10; and A represents (C₅-C₁₂)cycloalkyl. Preferably, Z is Ar, R¹²OArOR¹², (R¹³O)_(a)Ar(OR¹³)_(a), or R¹²CyR¹². Preferably, r=1-3 and more preferably 1-2. Each Ar group may optionally be substituted by replacing one or more hydrogens with a substituent, such as, but not limited to, (C₁-C₄)alkyl, (C₁-C₄)alkoxy, and halogen. Ar is preferably (C₆-C₁₅)aryl. Exemplary aryl groups include, but are not limited to, phenyl, methylphenyl, naphthyl, pyridinyl, bisphenylmethane, and 2,2-bisphenyl-propane. Cy is preferably (C₆-C₅)cycloalkyl. The (C₅-C₁₂)cycloalkyl groups for A may be a monocyclic, spirocyclic, fused and/or bicyclic groups. Preferably, A represents a (C₈-C₁₀)cycloalkyl, and more preferably cyclooctyl. Each R¹² is preferably (C₁-C₆)alkyl and more preferably (C₁-C₄)alkyl. Each R¹³ is preferably (C₂-C₄)alkyleneoxy. It is preferred that a=1-8, more preferably 1-6 and still more preferably 1-4.

Exemplary reaction products of formula (I) include, without limitation, compounds of formulae Ia, Ib, Ic and Id:

wherein Y¹ and Y² are independently chosen from H and (C₁-C₄)alkyl; each R⁶ and R⁷ are independently chosen from H, CH₃ and OH; each R¹¹ represents (C₁-C₄)alkyl or (C₁-C₄)alkoxy; b=0-4; p=1-6; and q=0 or 1. Y¹ and Y² are preferably independently chosen from H and (C₁-C₂)alkyl. More preferably, Y¹ and Y² are both H. It is preferred that p=1-4, more preferably 1-3, and still more preferably 1-2. When q=0, the ring structure is a 5-membered carbocyclic ring and when q=1, the ring structure is a 6-membered carbocyclic ring. Exemplary compounds of formula Id are 1,2-cyclohexanedimethanol diglycidyl ether and 1,4-cyclohexanedimethanol diglycidyl ether, and preferably 1,4-cyclohexanedimethanol diglycidyl ether.

Exemplary reaction products of formula (II) include, without limitation, compounds of formula IIa.

Other preferred compounds of formula II include dicyclopentadiene dioxide and 1,6-diepoxy-cyclodecane.

The epoxide-containing compounds useful in the present invention can be obtained from a variety of commercial sources, such as Sigma-Aldrich, or can be prepared using a variety of literature methods known in the art.

The reaction products of the present invention can be prepared by reacting one or more amine compounds described above with one or more epoxide-containing compounds described above. Typically, a desired amount of the imidazole and epoxy-containing compounds were added into the reaction flask, followed by addition of water. The resulting mixture is heated to approximately to 75-95° C. for 4 to 6 hours. After an additional 6-12 hours of stirring at room temperature, the resulting reaction product is diluted with water. The reaction product may be used as-is in aqueous solution, may be purified or may be isolated as desired.

In general, the present reaction products have a number average molecular weight (Mn) of 500 to 10,000, although reaction products having other Mn values may be used. Such reaction products may have a weight average molecular weight (Mw) value in the range of 1000 to 50,000, although other Mw values may be used. Typically, Mw is from 1000 to 20,000. In one embodiment, Mw is 1500 to 5000. In another embodiment, Mw is 5000 to 15,000.

Typically, the ratio of the one or more amine compounds to the one or more epoxide-containing compounds is from 0.1:10 to 10:0.1. Preferably, the ratio is from 0.5:5 to 5:0.5 and more preferably from 0.5:1 to 1:0.5. Other suitable ratios of amine compound to epoxide-containing compound may be used to prepare the present leveling agents.

It will be appreciated by those skilled in the art that a reaction product of the present invention may also possess functionality capable of acting as a suppressor. Such compounds may be dual-functioning, i.e. they may function as leveling agents and as suppressors.

The amount of the reaction product (leveling agent) used in the metal electroplating baths will depend upon the particular leveling agents selected, the concentration of the metal ions in the electroplating bath, the particular electrolyte used, the concentration of the electrolyte and the current density applied. In general, the total amount of the leveling agent in the electroplating bath is from 0.01 ppm to 5,000 ppm based on the total weight of the plating bath, although greater or lesser amounts may be used. Preferably, the total amount of the leveling agent is from 0.5 to 5000 ppm, more preferably from 0.5 to 1000 ppm, and even more preferably from 0.5 to 100 ppm.

The leveling agents of the present invention may possess any suitable molecular weight polydispersity. The present leveling agents work over a wide molecular weight polydispersity range.

The electroplating baths of the present invention are typically aqueous. Unless otherwise specified, all concentrations of components are in an aqueous system. Preferably compositions useful as electroplating baths in the present invention include a soluble copper salt, an acid electrolyte, an accelerator, a suppressor, halide ion and a reaction product described above as a leveling agent. More preferably, suitable compositions include 10 to 220 g/L of a soluble copper salts as copper metal, 5 to 250 g/L of acid electrolyte, 1 to 50 mg/L of an accelerator, 1 to 10,000 ppm of a suppressor, 10 to 100 ppm of a halide ion, and 0.25 to 5000 ppm of a reaction product described above as a leveling agent.

The electroplating baths of the present invention may be prepared by combining the components in any order. It is preferred that the inorganic components such as source of copper ions, water, electrolyte and optional halide ion source, are first added to the bath vessel followed by the organic components such as leveling agent, accelerator, suppressor, and any other organic component.

The present electroplating baths may optionally contain a second leveling agent. Such second leveling agent may be another leveling agent of the present invention, or alternatively, may be any conventional leveling agent. Suitable conventional leveling agents that can be used in combination with the present leveling agents include, without limitations, those disclosed in U.S. Pat. Nos. 6,610,192 (Step et al.), 7,128,822 (Wang et al.), 7,374,652 (Hayashi et al.), and 6,800,188 (Hagiwara et al.). Such combination of leveling agents may be used to tailor the characteristics of the plating bath, including leveling ability, throwing power and nodule reduction.

Typically, the plating baths of the present invention may be used at any temperature from 10 to 65° C. or higher. Preferably, the temperature of the plating baths is from 10 to 35° C. and more preferably from 15 to 30° C.

In general, the present copper electroplating baths are agitated during use. Any suitable agitation method may be used with the present invention and such methods are well-known in the art. Suitable agitation methods include, but are not limited to, air sparging, work piece agitation, and impingement.

Typically, a substrate is electroplated by contacting the substrate with the plating bath of the present invention. The substrate typically functions as the cathode. The plating bath contains an anode, which may be soluble or insoluble. Potential is typically applied to the cathode. Sufficient current density is applied and plating performed for a period of time sufficient to deposit a copper layer having a desired thickness on the substrate as well as fill blind vias and/or through holes. Suitable current densities, include, but are not limited to, the range of 0.05 to 10 A/dm², although higher and lower current densities may be used. The specific current density depends in part upon the substrate to be plated and the leveling agent selected. Such current density choice is within the abilities of those skilled in the art.

The present invention is useful for depositing a copper layer on a variety of substrates, particularly those having variously sized apertures. Accordingly, the present invention provides a method of depositing a copper layer on a substrate including the steps of: contacting a substrate to be plated with copper with the copper plating bath described above; and then applying a current density for a period of time sufficient to deposit a copper layer on the substrate. For example, the present invention is particularly suitable for depositing copper on printed circuit boards with blind vias and through-holes.

Copper is deposited in apertures according to the present invention without substantially forming voids within the metal deposit. By the term “without substantially forming voids”, it is meant that >95% of the plated apertures are void-free. It is preferred that the plated apertures are void-free. Copper is also deposited uniformly in through-holes and in high aspect ratio through-holes with improved throwing power, surface distribution and thermal reliability.

While the process of the present invention has been generally described with reference to printed circuit board manufacture, it will be appreciated that the present invention may be useful in any electrolytic process where an essentially level or planar copper deposit and filed apertures that are substantially free of voids are desired. Such processes include semiconductor packaging and interconnect manufacture.

An advantage of the present invention is that substantially level copper deposits are obtained on a PCB. By “substantially level” copper layer is meant that the step height, i.e., the difference between areas of dense very small apertures and areas free of or substantially free of apertures, is less than 5 μm, and preferably less than 1 μm. Through-holes and/or blind vias in the PCB are substantially filled with substantially no void formation. Further, such copper deposits have reduced nodules formation as compared to conventional copper plating processes. A further advantage of the present invention is that a wide range of apertures and aperture sizes may be filled within a single substrate with substantially no suppressed local plating. Thus, the present invention is particularly suitable for filling blind vias and/or through-holes in a printed circuit board, where such blind vias and through-holes are substantially free of added defects. “Substantially free of added defects” refers to the leveling agent not increasing the number or size of defects, such as voids, in filled apertures as compared to control plating baths not containing such leveling agent. A further advantage of the present invention is that a substantially planar copper layer may be deposited on a PCB having non-uniformly sized apertures. “Non-uniformly sized apertures” refer to apertures having a variety of sizes in the same PCB.

Throwing power is defined as the ratio of the average thickness of the metal plated in the center of a through-hole compared to the average thickness of the metal plated at the surface of the PCB sample and is reported as a percentage. The higher the throwing power, the better the plating bath is able to fill the through-hole. Copper plating baths of the present invention have a throwing power of ≧70%, preferably ≧75%, and more preferably >80%. Copper plating baths of the present invention also show reduced nodule formation on a copper plated substrate as compared to conventional copper plating baths. Preferably, the present copper plating baths provide copper deposits having ≦15 nodules per 95 cm² surface area, more preferably ≦10 nodules per 95 cm², and still more preferably ≦8 nodules per 95 cm². The throwing power, amount of nodules formed and percentage cracking are all determined as described in Example 7.

EXAMPLE 1

Resorcinol diglycidyl ether (94.5 mmol), 150 mmol of imidazole and 10 mL of diethylene glycol were added at room temperature to a round-bottom reaction flask set in a heating bath. Then, 40 mL of DI water were added to the flask. The temperature of the heating bath was set to 98° C. The initially formed white colored suspension eventually dissolved as the reaction temperature increased and turned into a transparent amber color solution. The reaction mixture was heated for 5 hours and left stirring at room temperature for another 8 hours. The reaction product (Reaction Product 1) was used without further purification. Characterization data for this reaction product are shown in Table 1 below. A working stock solution of this product was prepared using water as the solvent.

EXAMPLE 2

2,4-Dimethylimidazole (100 mmol), 56.7 mmole of 1,4-butanediol diglycidyl ether and 6.3 mL of resorcinol diglycidyl ether were added at room temperature to a round-bottom reaction flask set in a heating bath. Then, 15 mL of DI water were added to the flask. The temperature of heating bath was set to 95° C. The reaction mixture was heated for 6 hours and left stirring at room temperature for another 8 hours. The reaction product (amber color) (Reaction Product 9) was used without further purification. Characterization data for this reaction product are shown in Table 1 below. A working stock solution of this reaction product was prepared using DI water as the solvent.

EXAMPLE 3

Reaction Products 2-8 were prepared according to the procedures of Examples 1 or 2. The molar ratio of components and the characterization data for the reaction products are shown in Table 1. The UV-absorption of the reaction products was determined in water using an Agilent 8453 spectrophotometer and the λ_(max) (nm) is reported in the following table.

TABLE 1 Reaction Molar ratio Product Monomer 1 Monomer 2 Monomer 3 M1:M2:M3 λ_(max) (nm) 1

1:0.63 198, 218, 272, 278 2

1:0.81 198, 218, 273, 278 3

1:0.63 210 4

1:0.63 214 5

1:0.80 218 6

1:0.80 255, 262, 269, 275 7

1:0.57:0.06 217 8

1:0.32:0.32 217 9

1:0.56:0.06 198, 202, 217, 273, 279

EXAMPLE 4

The reaction products in Table 2 are expected to be prepared according to the procedures of Examples 1 or 2. The following abbreviations are used in Table 2: t-Bu=tertiary butyl; Pr=propyl; Me=methyl; Et=ethyl; and Ph=phenyl.

EXAMPLE 5

A conventional leveling agent, comparative reaction product C-1, was prepared generally according to the procedure of Example 1 using imidazole as the amine compound and epichlorohydrin as the epoxy-containing compound in a molar ratio of 1:2.

EXAMPLE 6

Various copper plating baths were prepared by combining 75 g/L copper as copper sulfate pentahydrate, 240 g/L sulfuric acid, 60 ppm chloride ion, 1-3 ppm of an accelerator and 1.5 g/L of a suppressor. The accelerator was a disulfide compound having sulfonic acid groups and a molecular weight of <1000. The suppressor was an EO/PO copolymer having a molecular weight of <5,000 and having one terminal ether group. Each plating bath also contained the amount of a reaction product from Examples 1, 2, 3 or 5 as reported in Table 3. The particular amount of accelerator (“ACC.”) used in each plating bath is also reported in Table 3.

TABLE 2 Reaction Molar ratio Product Monomer 1 Monomer 2 Monomer 3 M1:M2:M3 10

Pr₃N

3:1:2.5 11 t-Bu₂NH

1:0.63 12

1:0.50 13 Me₂NCH₂CH₂NMe₂

1:0.80 14 Ph₂NH

1:0.63 15 Ph₂NH H₂NCH₂CH₂NH₂

1:0.3:0.80 16

1:0.57:0.06 17 PhN(Me)H

1:0.32:0.32 9

1:025:040

EXAMPLE 7

Samples (either 3.2 mm or 1.6 mm thick) of a double-sided FR4 PCB (5×9.5 cm) having through-holes were plated in a Haring cell using copper plating baths according to Example 6. The 3.2 mm thick samples had 0.3 mm diameter through-holes and the 1.6 mm thick samples had 0.25 mm diameter through-holes. The temperature of each bath was 25° C. A current density of either 2.16 A/dm² (20 A/ft²) or 3.24 A/dm² (30 A/ft²) was applied to each bath for 80 minutes. The copper plated samples were analyzed to determine the throwing power (“TP”) of the plating bath, nodule formation, and percent cracking according to the following methods. The results are reported in Table 3.

Throwing power was calculated by determining the ratio of the average thickness of the metal plated in the center of a through-hole compared to the average thickness of the metal plated at the surface of the PCB sample and is reported in Table 3 as a percentage.

Nodule formation was determined both by visual inspection and by using the Reddington Tactile Test (“RTT”). Visual inspection showed the presence of nodules while the RTT was used to determine the number of nodules. The RTT employs a person's finger to feel the number of nodules for a given area of the plated surface, which in this example was both sides of the PCB sample (total area of 95 cm²).

The amount of cracking (reported in Table 3 as a percentage) was determined according to the industry standard procedure, IPC-TM-650-2.6.8. Thermal Stress, Plated-Through Holes, published by IPC (Northbrook, Ill., USA), dated May, 2004, revision E.

As can be seen from the data, the leveling agents of the present invention have greatly reduced nodule formation as compared to conventional leveling agents (C-1) and also show very good throwing power.

TABLE 3 Sample Reaction Thickness Acc. TP Cracking Product ppm (mm) A/dm² (ppm) (%) Nodules (%) C-1 1 3.2 2.16 1 77 Too 5-8 5 3.2 2.16 1 67 many to 5-8 count 5 1.6 3.24 1 72 Too 5-8 many to count 1 0.25 3.2 2.16 1 67 0 10 0.5 3.2 2.16 1 71 96 0.25 3.2 2.16 3 61 44 2 0.5 3.2 2.16 1 65 0 44 1 3.2 2.16 1 59 94 1 3.2 2.16 3 75 100 3 1 3.2 2.16 1 47 0 0 5 3.2 2.16 1 53 0 10 3.2 2.16 1 45 0 4 5 3.2 2.16 1 60 0 0 10 3.2 2.16 1 55 0 5 1 1.6 3.24 1 83 0 0 6 1 3.2 2.16 2 82 0 46 5 3.2 2.16 2 101 100 7 1 1.6 3.24 1 78 0-3 0 5 1.6 3.24 1 82 0-3 0 10 1.6 3.24 1 79 0-3 0 8 1 1.6 3.24 1 83 0 0 5 1.6 3.24 1 75 4 0 10 1.6 3.24 1 79 2 0 9 1 1.6 3.24 1 81 0 0 5 1.6 3.24 1 79 0 

1. A copper electroplating bath comprising: a source of copper ions, an electrolyte, and a reaction product of one or more nitrogen-containing compounds with one or more epoxide-containing compounds of formula (I) or (II)

wherein Y¹ and Y² are independently chosen from H and (C₁-C₄)alkyl; Z is Ar, R¹²OArOR¹², (R¹³O)_(a)Ar(OR¹³)_(a), Cy, R¹²CyR¹², or (R¹³O)_(a)Cy(OR¹³)_(a); r=1-4; Ar=(C₆-C₁₈)aryl; Cy=(C₅-C₁₂)cycloalkyl; each R¹² represents (C₁-C₈)alkyl; each R¹³ represents a (C₂-C₆)alkyleneoxy; each a=1-10; and A represents (C₅-C₁₂)cycloalkyl as a leveling agent.
 2. The copper electroplating bath of claim 1 further comprising a second leveling agent.
 3. A method of depositing copper on a substrate comprising: contacting a substrate to be plated with the copper electroplating bath of claim 1 and applying a current density for a period of time sufficient to deposit a copper layer on the substrate.
 4. The method of claim 3 wherein the substrate is a printed circuit board.
 5. The method of claim 4 wherein the printed circuit board comprises through-holes.
 6. The copper electroplating bath of claim 1 wherein the nitrogen-containing compound is chosen from amines, amides, ureas, guanides, uracils, thiouracils, pyrrolidines, imidazoles, triazoles, tetrazoles, benzimidazoles, benzotriazoles, piperidines, morpholines, piperazines, pyridines, oxazoles, benzoxazoles, pyrimidines, quinolines, and isoquinolines.
 7. The copper electroplating bath of claim 1 wherein Z is Ar, R¹²OArOR¹², R¹³O)_(a)Ar(OR¹³)_(a), or R¹²CyR¹².
 8. The copper electroplating bath of claim 1 wherein A represents a (C₈-C₁₀)cycloalkyl.
 9. The copper electroplating bath of claim 1 wherein Y¹ and Y² are both H.
 10. The copper electroplating bath of claim 1 wherein the source of copper ions is selected from copper sulfate, copper halides, copper acetate, copper nitrate, copper fluoroborate, copper alkylsulfonates, copper arylsulfonates, copper sulfamate, copper gluconate, and mixtures thereof.
 11. The copper electroplating bath of claim 1 wherein the electrolyte is selected from sulfuric acid, acetic acid, fluoroboric acid, alkanesulfonic acids, arylsulfonic acids, sulfamic acid, hydrochloric acid, phosphoric acid and mixtures thereof. 